APD Package Design @ Cerebra

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APD Package Design

Cerebra
5 - 10 years
Bengaluru
3 months ago
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Job Description

Job Description:

Role: Cadence APD Package Design

Experience: 5+ Years

Location: Bangalore

IC Package Design Engineer
Experience with Cadence APD IC Package Design experience with Cadence APD
Good understanding of package/substrate design and package assembly rules related to flip chip designs.
Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies.
Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES.
Good Exposure to Stackup design, DFM, DFA rules and adherence.
Should have expertise in constraint setting in layout tool.

Job Classification

Industry: IT Services & Consulting
Functional Area / Department: Engineering - Software & QA
Role Category: Software Development
Role: Software Development - Other
Employement Type: Full time

Contact Details:

Company: Cerebra
Location(s): Bengaluru

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Keyskills: PCB Designing cadence APD MCM APD IC Package Design Ic Packaging Packaging Design 3D wire bond Ddr GDDR HDI

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Cerebra

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APD Package Design @ Cerebra

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